-
MSA 70%
The product is a 70% aqueous solution of methane sulfonic acid (MSA). MSA is a strong organic acid. MSA undergoes biodegradation by forming CO2 and sulphate. It is considered a green acid as it is less toxic and corrosive in comparison to mineral acids. The aqueous MSA solution has been considered a model electrolyte for electrochemical processes.
-
Tin(II) Methane Sulfonate Solution, 300 g/L
Tin(II) methanesulfonate solution 300 is an electroplating material and corrosion inhibitor from InnoChem.
-
Tin(II) Methane Sulfonate Solution, 400 g/L
Tin(II) methanesulfonate solution 400 is an electroplating material and corrosion inhibitor from InnoChem.
-
TinMS 400 DA5 (Acid Deficit of Tin(II) Methane Sulfonate Solution, 400 g/L)
TinMS400 DA-5, the latest tin product from InnoChem, is a source of highly concentrated stannous methane sulfonate.
-
TinMS 400 DA20
DA-20, the latest tin product from Innochem, is a source of highly concentrated stannous methane sulfonate.
-
Stannox (Tin Replenisher)
STANNOX, the latest tin replenishment product from Innochem, is a source of highly concentrated stannous tin in a fluid base. It offers particular advantages for electroplating installations where metal replenishment by the addition of
solution concentrates leads to chemistry imbalance.
-
NEUTRASTAN (Tin Replenisher)
Neutrastan, a new user-friendly product from InnoChem, is a source of highly concentrated stannous tin in a fluid and neutral pH form. It replenishes the plating bath tin content, and in the meantime, neutralizes the excessive free acid.
-
CHEMCLENS EC-66
CHEMCLENS EC-66 is a highly alkaline liquid soak and electrocleaner for ferrous metals, copper, and copper plated work. The low foam characteristics of the cleaner make it an ideal choice for spray cleaners, high agitation reel to reel and wire plating operations.
-
Stannolite MW
Stannolite MW is a methane sulfonic acid (MSA) based tin plating process specifically formulated for wire plating applications. The additive components are stable under conditions encountered in state of the art wire plating equipment and will produce a consistent, light colored, fine grained deposit over a wide current density range.